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[Data] Removal of polymer residue after dry etching from the wafer.

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This document is a technical material proposing the "perc" process. Anisotropic dry etching is performed while forming a protective film, such as a polymer, to protect the sidewalls. Traditionally, cleaning has been done using dedicated organic solvent-based cleaning solutions, but this practice has started to be avoided due to safety and environmental concerns. 【Contents】 ■ Introduction ■ Process Overview ■ "perc" Cleaning Performance ■ Application to Plasma Dicing ■ Conclusion *For more details, please download the PDF or feel free to contact us.